成形用樹脂組成物、成形品および半導体パッケージ

Resin composition for molding, molded article and semiconductor package

Abstract

【課題】熱硬化性樹脂をベースとして、高寸法精度、低反り、低熱膨張、高耐熱の樹脂パッケージを提供する。 【解決手段】(A)所定の構造を有するナフタレン骨格を有するエポキシ樹脂と、(B)所定の構造を有するフェノールアラルキル樹脂硬化剤と、(C)硬化促進剤と、(D)重量平均粒径10〜30μmの溶融シリカ粉末と、を必須成分とし、(D)溶融シリカ粉末が成形用樹脂組成物中に80〜90質量%の割合で含有されており、かつ成形用樹脂組成物中にハロゲン原子を含有していない成形用樹脂組成物。 【選択図】なし
PROBLEM TO BE SOLVED: To provide a resin package based on a thermosetting resin, and having a high dimensional accuracy, low warpage, low thermal expansion and high heat resistance. SOLUTION: This resin composition for molding comprises (A) an epoxy resin having a naphthalene backbone having a prescribed structure, (B) a phenolaralkyl resin-curing agent having a prescribed structure, (C) a curing accelerator and (D) fused silica powder having 10 to 30 μm weight-average particle diameter, wherein the fused silica powder (D) is contained in the molding resin composition in a rate of 80 to 90 mass% and the molding resin composition contains no halogen atom. COPYRIGHT: (C)2009,JPO&INPIT

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Patent Citations (1)

    Publication numberPublication dateAssigneeTitle
    WO-2007037500-A1April 05, 2007Sumitomo Bakelite Co., Ltd.Composition de résine époxyde et dispositif à semi-conducteur

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Cited By (3)

    Publication numberPublication dateAssigneeTitle
    JP-2011096940-AMay 12, 2011Kyocera Chemical Corp, 京セラケミカル株式会社Fiber-reinforced resin case, method for manufacturing the same, and hollow resin package device for storing electronic component
    KR-101142300-B1May 07, 2012주식회사 케이씨씨Epoxy resin composition for sealing semiconductor element
    KR-101266542-B1May 23, 2013제일모직주식회사반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 패키지