Molding method and molding machine system



PROBLEM TO BE SOLVED: To easily and surely provide a molded article with an IC tag embedded. SOLUTION: A molding method of molding the molded article by filling melted resin into a cavity of a mold from a nozzle at the tip of a heating cylinder comprises filling the non-contact type IC tag to which heat resistant coating is performed, together with the melted resin into the cavity to mold the molded article with the built-in IC tag. COPYRIGHT: (C)2009,JPO&INPIT
【課題】ICタグが埋め込まれた成形品を、簡単・確実に得られるようにすること。 【解決手段】加熱シリンダの先端のノズルから、溶融樹脂を金型のキャビティ内に充填することにより、成形品を成形する成形方法において、溶融樹脂と共に耐熱性コーティングを施した非接触式のICタグをキャビティ内に充填して、ICタグが内蔵された成形品を成形する。 【選択図】図1




Download Full PDF Version (Non-Commercial Use)

Patent Citations (1)

    Publication numberPublication dateAssigneeTitle
    JP-2003026225-AJanuary 29, 2003Toppan Printing Co Ltd, 凸版印刷株式会社Packaging material with non-contact type ic chip

NO-Patent Citations (0)


Cited By (2)

    Publication numberPublication dateAssigneeTitle
    EP-2141551-A2January 06, 2010Ricoh Company, LimitedAppareil de formation d'images et unité de nettoyage
    US-8405493-B2March 26, 2013Mitomo CorporationApparatus for embedding wireless IC tags